Connection structure for overlapping dielectric waveguide lines

Abstract

A connection structure for dielectric waveguide lines, which includes dielectric waveguide lines including dielectric substrates, a pair of main conductor layers, dielectric substrates parallel with one another being sandwiched therebetween, two rows of side-wall through conductor groups arranged at intervals less than one half of a signal wavelength in a transmission direction of high-frequency signals, so as to electrically connect the pair of main conductor layers, and a sub conductor layer disposed between each pair of main conductor layers in parallel with the main conductor layers and electrically connected with the side-wall through conductor groups. The waveguides are stacked so that the main conductor layers partly overlap each other to define an overlap part, in which a coupling window is formed. This allows design freedom and easy fabrication. In addition, dielectric waveguide lines may be stacked so that the transmission directions of high-frequency signals are orthogonal to each other and one of the main conductor layers. The main conductor layers overlap each other to define an overlap part, in which a coupling window is disposed. This provides a connection structure with little transmission loss and excellent transmission characteristics.