The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2003
Filed:
Aug. 07, 2000
Andreas Bänisch, München, DE;
Sabine Kling, München, DE;
Infineon Technologies AG, Munich, DE;
Abstract
An integrated semiconductor chip has at least two metal interconnects of two different metallization planes, which are disposed parallel to one another. The metal interconnects are connected to one another via at least one electrically conductive contact point. The metal interconnects, for each direction, run orthogonally with respect to one another in a first region. For each direction, they run parallel to one another and at an oblique angle to the directions of the metal interconnects of the first region in a second region ( ), in which they are contact-connected to one another. This configuration makes it possible, with little influence of electromigration, to have a comparatively small space requirement needed for the contact connection of mutually orthogonal interconnects.