The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2003
Filed:
Feb. 02, 2000
Applicant:
Inventors:
Hironori Matsushima, Tokyo, JP;
Yoshihiro Tomita, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/312 ;
U.S. Cl.
CPC ...
H01L 2/312 ;
Abstract
A semiconductor chip is attached on a package substrate so as to be electrically connected to it and sealed. A ring member is attached to the package substrate and surrounds the semiconductor chip. A lid member is attached to the ring member and covers the semiconductor chip. The lid member is formed so as to be able to be removed from the ring member without impairing the attachment of the ring member to the package substrate.