The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2003
Filed:
Oct. 26, 1999
Applicant:
Inventors:
Heidi L. Denton, Scottsdale, AZ (US);
Henry G. Hughes, Scottsdale, AZ (US);
Thor D. Osborn, Everett, WA (US);
DaXue Xu, North Plainfield, NJ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/100 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/100 ;
Abstract
A component ( ) includes a substrate ( ), a cap wafer ( ), and a protection layer ( ) formed over a surface of the cap wafer ( ). Together, the protection layer ( ) and the cap wafer ( ) form a cap structure ( ) that is bonded to the substrate ( ) via a bonding layer ( ). An opening ( ) is formed in the cap wafer ( ) by etching the cap wafer ( ). The protection layer ( ) provides protection during etching of the cap wafer ( ) for the underlying bonding layer ( ) and devices ( ) formed in the substrate ( ).