The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2003
Filed:
Feb. 11, 2002
Korea Advanced Institute of Science and Technology, Taejon, KR;
Abstract
Disclosed is a method for manufacturing a low dielectric constant conductive adhesive that is appropriate for a radio frequency packaging application. This method is characterized by mixing a thermosetting resin with surface-treated conductive particles and non-conductive particles for prevention of agglutination and thereby forming the conductive adhesive. The manufactured conductive adhesive is useful for a bonding material of the radio frequency packaging. According to the present invention, it is possible to obtain a flip chip bonding having superior mechanical and electrical performance compared with the conventional flip chip bonding art. Also, since the adhesive has a low high frequency loss and a low dielectric constant, it is possible to realize a flip chip package having a superior electrical performance. The conductive adhesive is particularly useful for the flip chip packaging of a device having a bandwidth of microwave and millimeter wave.