The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2003

Filed:

Feb. 23, 2001
Applicant:
Inventors:

Mindaugas F. Dautartas, Blacksburg, VA (US);

Joseph M. Freund, Fogelsville, PA (US);

George J. Przybylek, Douglasville, PA (US);

Assignee:

Agere Systems Inc., Miami Lakes, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/310 ; H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/310 ; H01L 2/334 ;
Abstract

A method and apparatus are disclosed for supporting semiconductor devices on a flexible support which includes one or more thermoelectric cooling devices. The thermoelectric cooling devices, which include at least one pair of positively-doped and negatively-doped elements electrically coupled together, are positioned between a pair of flex panels. Each panel has connector sites at which connectors such as solder balls are located. The thermoelectric cooling devices may be arranged between the panels to create two or more device support areas having different temperature regimes. The thermoelectric cooling devices may be connected to the panels by placing the panels, connectors and thermoelectric cooling devices in a reflow chamber, exposing them to a reducing atmosphere, and heating to a temperature sufficient to reflow the connectors.


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