The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2003

Filed:

Mar. 13, 2001
Applicant:
Inventors:

Yung Chau Yen, Cupertino, CA (US);

Weng-Lyang Wang, Cupertino, CA (US);

Assignee:

CMOS Sensor, Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/700 ;
U.S. Cl.
CPC ...
H01L 2/700 ;
Abstract

A sensor chip with an on-chip operational amplifier is described for the formation into a sensor array of a Contact Image Sensor (CIS) module. A number of extra on-chip bonding pads are provided which are electrically connected to the operational amplifier, the associated input resistor and the charge integration capacitor in a selective manner. A number of extra off-chip common conductor stripes are also provided on the substrate for the chip array. A set of wiring patterns are then used to selectively connect these on-chip bonding pads with their corresponding off-chip common conductor stripes resulting in a CIS module which provides both a variable gain of a selected single operational amplifier and an equivalent charge integration capacitance which is the summation of the capacitors from the individual sensor chips within the chip array. Additionally, the associated input resistors can be replaced with an MOS transistor whose control gate can be similarly programmed with the wiring pattern.


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