The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2003

Filed:

Nov. 22, 2000
Applicant:
Inventors:

Yoshifumi Akaike, Tokyo, JP;

Takashi Suzuki, Kanagawa, JP;

Hiroyuki Nagai, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 4/900 ;
U.S. Cl.
CPC ...
B24B 4/900 ;
Abstract

A polishing apparatus and a polishing method capable of suppressing an excessive polishing of an outer circumferential edge surface of a surface to be polished of a polished object to be polished due to elastic deformation of a polishing tool and capable of stabilizing a polishing rate, wherein polishing is carried out by inclining a shaft of a polishing tool with an angle &agr; toward a direction of advance of the movement of the polishing tool to a direction perpendicular to a holding surface of a rotation table, then inclining the shaft of the polishing tool in a direction reducing elastic deformation of a polishing surface in a region where the polishing surface rides up on an outer circumferential edge of a surface to be polished of a wafer to the direction perpendicular to the holding face.


Find Patent Forward Citations

Akaike, Yoshifumi. (2003). Polishing apparatus and polishing method (U.S. Patent No. 6511362). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6511362

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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