The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2003

Filed:

Jun. 28, 2001
Applicant:
Inventors:

Brian D. Chapman, Poughkeepsie, NY (US);

Wai Mon Ma, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/373 ; H02B 1/01 ; H05K 7/02 ; H05K 7/06 ; H05K 7/08 ;
U.S. Cl.
CPC ...
H01R 1/373 ; H02B 1/01 ; H05K 7/02 ; H05K 7/06 ; H05K 7/08 ;
Abstract

This invention relates to electrically connecting a first electronic component to a second electronic component wherein at least one of the electronic components must undergo modifications or repair when, for example, there is a floating signal generated from the first electronic component which can cause problems in operation of the electronic component assembly. For this type assembly an opening is provided in the second electronic component proximate the site or sites to be electrically connected to the first electronic component, which opening extends to an internal plane of the second electronic component desired to be connected to the first electronic component. A wire having a melting point higher than the solder used to make the assembly is used to connect the internal plane of the second electronic component to the pad of the second electronic component which second electronic component is to be electrically connected to the first electronic component thereby avoiding a floating signal in the electronic component assembly.


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