The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2003
Filed:
Oct. 02, 2000
Eric Lee Hertz, Boca Raton, FL (US);
Galahad, Co., Boca Raton, FL (US);
Abstract
A method and apparatus are disclosed for placing solder balls on electronic pads or on a component or substrate such as for a ball grid array (BGA) applicator The solder balls are held to openings in a foil against a second layer by a holding force, whereby the second layer is of a porous material and laminated to the foil One such holding force can be a vacuum force applied to the solder balls through the openings in a foil After locating the solder balls at electronic pads or on a component or substrate by removing the holding force the solder balls are released and placed on the electronic pads Optionally, a plurality of pins may provide a releasing and/or placing force.