The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2003
Filed:
Jun. 29, 2001
Tatsuya Ohtaka, Ibaraki, JP;
Sachio Suzuki, Ibaraki, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
A TAB tape with a stiffener is prepared by bonding a one-metal TAB tape having a structure wherein a circuit pattern is formed on either surface of a first tape base material, a part thereof is covered with an insulating film , and a via hole is defined on a connecting regional section for via, to a tape for second metal prepared by providing a metallic foil layer on either surface of a second tape base material through an adhesive layer ; the connecting regional section for via on the upper edge of a via hole is electrically connected with a part of the metallic foil layer on the bottom of the hole by means of conducting means ( , and ), and at the same time, an exposed portion of the metallic foil layer , which has not been covered with the one-metal TAB tape , is connected to an electrode of a ground line in the semiconductor by means of a bonding wire to lead a ground potential. Thus, an inexpensive TAB tape with a stiffener having equivalent electrical characteristics to that in the case where a conventional two-metal and one-base material TAB tape is used, and a TBGA semiconductor device using such TAB tape with a stiffener is obtained.