The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2003
Filed:
Oct. 18, 2000
Applicant:
Inventors:
Shigeru Mori, Tokyo, JP;
Yoshinori Ono, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 ;
U.S. Cl.
CPC ...
H05K 1/03 ;
Abstract
A printed circuit board and a manufacturing method thereof can realize a thick film laminated structure of single resin material of low dielectric constant without reinforcement material. The printed circuit board is formed with an insulation layer of composite structure of a first resin material of low dielectric constant and a first general base material having different relative dielectric constants, and the insulation layer is disposed between conductor circuits.