The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6509087 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 21, 2003

Filed:

May. 02, 2001
Applicant:
Inventors:

Hideki Uehara, Takamatsu, JP;

Yoshio Matsuda, Sakaide, JP;

Kunio Sakauchi, Kagawa-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 2/732 ;
U.S. Cl.
CPC ...
B32B 2/732 ;
Abstract

A heat shrinkable, coextruded polyethylene film laminate having two surface layers, and an intermediate layer interposed therebetween, wherein each of the surface layers comprises a linear low density polyethylene having a density of 0.910-0.930 g/cm and a linear high density polyethylene having a density of 0.925-0.945 g/cm and wherein the intermediate layer comprises a linear low density polyethylene having a density of 0.910-0.930 g/cm and a linear very low density polyethylene having a density of 0.880-0.915 g/cm .


Find Patent Forward Citations

Uehara, Hideki. (2003). Heat shrinkable, coextruded polyethylene film laminate (U.S. Patent No. 6509087). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6509087

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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