The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2003

Filed:

Oct. 06, 2000
Applicant:
Inventors:

Hiroyuki Otaki, Tokyo-To, JP;

Kenji Ueda, Tokyo-To, JP;

Kazumasa Shinga, Tokyo-To, JP;

Masahiro Kawasaki, Tokyo-To, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03H 1/04 ; B32B 7/12 ; B32B 1/504 ;
U.S. Cl.
CPC ...
G03H 1/04 ; B32B 7/12 ; B32B 1/504 ;
Abstract

A pressure-sensitive adhesive for a pressure-sensitive adhesive layer in a volume hologram laminate is provided which, when kept in the pressed state, for example, during storage, is less likely to cause spotty hologram defects in the volume hologram layer. The pressure-sensitive adhesive for a pressure-sensitive adhesive layer in a volume hologram laminate is a pressure-sensitive adhesive for a pressure-sensitive adhesive layer in a volume hologram laminate comprising a substrate and, stacked on the substrate in the following order, a first pressure-sensitive adhesive layer a volume hologram layer a second pressure-sensitive adhesive layer and a surface protective film the second pressure-sensitive adhesive layer having been formed from an acrylic pressure-sensitive adhesive comprising an acrylic copolymer resin, composed mainly of an alkyl acrylate, and a crosslinking agent, the second pressure-sensitive adhesive layer having a dynamic storage modulus of not less than 2.5×10 Pa as measured at a measuring frequency of 6.28 rad/sec and a temperature of 50° C. and a loss tangent (tan &dgr;) defined as dynamic loss modulus/dynamic storage modulus at 120° C. of not more than 0.15.


Find Patent Forward Citations

Otaki, Hiroyuki. (2003). Pressure-sensitive adhesive for pressure-sensitive adhesive layer in volume hologram laminate (U.S. Patent No. 6509076). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6509076

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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