The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2003

Filed:

Dec. 08, 1999
Applicant:
Inventors:

Tsung-Ho Lee, Ping Tong Hsien, TW;

Kang-Hua Lee, Kaohsiung, TW;

Tsui-Ping Yeh, Kaohsiung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09K 1/300 ; C09K 1/304 ; C09K 1/306 ; H01L 2/1302 ;
U.S. Cl.
CPC ...
C09K 1/300 ; C09K 1/304 ; C09K 1/306 ; H01L 2/1302 ;
Abstract

The invention provides a chemical mechanical abrasive composition for use in semiconductor processing, which comprises phosphorous acid and/or a salt thereof as an abrasive enhancer. The chemical mechanical abrasive composition of the invention can be in the form of a slurry which comprises 70-99.5% by weight of an aqueous medium, 0.1-25% by weight of an abrasive, and 0.01-2% by weight of said abrasion enhancer. The chemical mechanical abrasive composition of the invention may further comprise an abrasion co-enhancer selected from an amino acid, a salt thereof, a carboxylic acid, a salt thereof, or a mixture of the acids and/or salts.


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