The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2003
Filed:
Mar. 08, 2000
Applicant:
Inventors:
Timothy E. Beerling, Corvallis, OR (US);
Timothy L. Weber, Corvallis, OR (US);
Melissa D. Boyd, Corvallis, OR (US);
Assignee:
Hewlett-Packard Company, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/155 ;
U.S. Cl.
CPC ...
B41J 2/155 ;
Abstract
A method of mounting a fluid ejection device having a first plurality of pads on a carrier substrate having a corresponding second plurality of pads includes positioning the first plurality of pads with respect to the second plurality of pads, and melting solder between the first plurality of pads and the second plurality of pads. Melting the solder includes aligning the first plurality of pads with respect to the second plurality of pads with a solder reflow force and forming a fluidic boundary between the fluid ejection device and the carrier substrate with the solder.