The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2003

Filed:

Jun. 30, 1998
Applicant:
Inventors:

Satoshi Ishino, Kusatsu, JP;

Kenji Kubota, Sabae, JP;

Tsuyoshi Saito, Fukui, JP;

Michinobu Maesaka, Omihachiman, JP;

Mamoru Ogawa, Moriyama, JP;

Jiro Inoue, Omihachiman, JP;

Hiroaki Kaida, Moriyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 4/108 ;
U.S. Cl.
CPC ...
H01L 4/108 ;
Abstract

An electronic component includes a package member; a via hole electrode extending through the package member and protruding from a first surface of the package member; an electronic component located on the first surface of the package member with a space located between the package member and the electronic component. The space between the electronic component and the first surface of the package member is provided by a protruding portion of the via hole electrode which extends from the surface of the package member and a joining member joining the electronic component with the via hole electrode.


Find Patent Forward Citations

Ishino, Satoshi. (2003). Apparatus having an electronic component located on a surface of a package member with a space therebetween (U.S. Patent No. 6507139). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6507139

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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