The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2003
Filed:
Jul. 14, 2000
Randolph D. Schueller, Austin, TX (US);
3M Innovative Properties Company, St. Paul, MN (US);
Abstract
A printed circuit assembly includes an interposer circuit having a flexible dielectric core with an array of contact members attached thereto. Each contact member includes a first interconnect surface accessible from a first side of the dielectric core and a second interconnect surface accessible from a second side of the dielectric core. A conductive element is attached to the first interconnect surface of each contact member. A flip chip semiconductor die includes an array of bond pads on a mounting surface thereof. Each bonding pad of the semiconductor die is substantially aligned with a respective one of the first interconnect surfaces of the interposer circuit. Each bonding pad is electrically connected to the corresponding conductive element. The electronic device defines a perimeter edge that circumscribes the array of bonding pads and the array of contact members of the interposer circuit. A solder ball is attached to the second interconnect surface of each contact member. A printed circuit substrate includes an array of solder ball pads on a surface thereof. Each one of the solder ball pads is substantially aligned with a respective one of the second interconnect surfaces. Each one of the solder ball pads is electrically connected to the corresponding solder ball.