The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2003
Filed:
Sep. 07, 2000
Applicant:
Inventors:
Andreas Lindemann, Lampertheim, DE;
Bernt Leukel, Hemsbach, DE;
Assignee:
IXYS Semiconductor GmbH, Lampertheim, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/334 ;
Abstract
The invention relates to a power semiconductor module ( ) having a baseplate ( ) on which at least one substrate ( ) is arranged which is fitted with power semiconductor chips ( ) and can be pressed via pressure elements and contact cords ( ) against the baseplate ( ). The baseplate ( ) has centering elements on which a frame ( ) which defines fields ( ) and is in the form of a grid is provided, with corresponding substrates ( ) with power semiconductor chips being arranged in at least some of the fields ( ), which substrates ( ) can be made contact with via contact rails ( ).