The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2003
Filed:
Jun. 22, 2001
Christy Mei-Chu Woo, Cupertino, CA (US);
Connie Pin-Chin Wang, Menlo Park, CA (US);
Steve C. Avanzino, Cupertino, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A method of forming interconnects on a semiconductor chip is disclosed which comprises the steps of: depositing a barrier layer and a copper seed layer on the semiconductor chip; depositing on the copper seed layer an enhancement layer; annealing the semiconductor chip a first time after the copper seed layer and the enhancement layer are deposited to form an annealed layer; electroplating a copper layer on the semiconductor chip; and annealing the semiconductor chip a second time after the copper layer is deposited on the annealed layer to form an annealed copper conductive layer.