The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2003
Filed:
Feb. 21, 2001
Applicant:
Inventor:
Hans-Jürgen Hacke, München, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ; H01L 2/14763 ;
Abstract
A method for manufacturing integrated circuits is described. A semiconductor wafer having an active side with circuit structures is provided. An electrically insulating intermediate layer and an electrically conductive conductor foil are applied to the active side. Conductor tracks with terminal balls are formed with a relatively large spacing pattern in the conductor foil. The semiconductor wafer is subsequently divided up into integrated circuits.
Hacke, Hans-Jürgen. (2003). Method for manufacturing integrated circuits and semiconductor wafer which has integrated circuits (U.S. Patent No. 6506631). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6506631
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile