The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2003
Filed:
Aug. 22, 2000
Shouji Yamamoto, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A pressure-sensitive adhesive sheet for dicing is disclosed which can prevent the generation of a fibrous waste during dicing without having a decrease in product quality or a disadvantage in cost. The pressure-sensitive adhesive sheet for dicing comprises a substrate film and formed thereon a pressure-sensitive adhesive layer for adhesively fixing a material to be diced, wherein the substrate film has a single- or multilayer structure wherein at least the layer thereof in contact with the pressure-sensitive adhesive layer comprises a semi- or non-compatibilized polymer blend comprising two or more polymers. At least one of the polymers constituting the polymer blend may be a highly crystalline olefin resin having a crystallinity of 40% or higher and the content of this polymer in the polymer blend may be from 1 to 50% by weight. Furthermore, at least one of the polymers constituting the polymer blend may be a lowly crystalline olefin resin having a crystallinity lower than 40% and the content of this polymer in the polymer blend may be from 50 to 99% by weight.