The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2003
Filed:
Sep. 10, 1999
Werner Baeskow, Hessigheim, DE;
Beru G, Ludwigsburg, DE;
Abstract
A process for producing an electronic component, such as a Hall sensor, in which electronic parts are located in a plastic housing. The process includes the steps of locating the electronic parts in a hot-melt adhesive, allowing the hot-melt adhesive to solidify, and finish-extrusion coating the electronic parts in the solidified hot-melt adhesive to form the housing. In an alternative embodiment, the process may also include the step of embedding the electronic parts in the hot-melt adhesive. In yet another embodiment, the process may also include the step of extrusion-coating the electronic parts with the hot-melt adhesive. Materials having substantially similar coefficients of thermal expansion may be used for the hot-melt adhesive used for mounting the electronic parts, and for the finish-extrusion coating that forms the housing to minimize effects of thermal expansion. The process is efficient and cost effective.