The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2003

Filed:

Mar. 30, 2000
Applicant:
Inventors:

Venkatarayaloo Janarthanan, Gujarat, IN;

Roland P. Brassard, Agawam, MA (US);

Karl-Erwin Piejko, Longmeadow, MA (US);

Sara D. Graham, Amsterdam, NY (US);

Assignee:

Bayer Corporation, Pittsburgh, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 2/736 ; C08K 5/09 ; C08K 5/10 ; C08G 6/348 ;
U.S. Cl.
CPC ...
B32B 2/736 ; C08K 5/09 ; C08K 5/10 ; C08G 6/348 ;
Abstract

A thermoplastic molding composition comprising, (A) an aromatic polycarbonate; (B) a single rubber-free copolymer, e.g., of styrene and acrylonitrile; (C) a first graft polymer; (D) a second graft polymer; and (E) a wax, is described. The single rubber-free copolymer (B), and first and second graft polymers (C) and (D) are prepared from a specific selection of graft phases and graft bases. The graft base of the first graft polymer (C) comprises a crosslinked, particulate elastomer having an average particle diameter of 0.05 to 0.5 microns. The second graft polymer (D) has an average particle diameter of 0.6 to 20 microns. The thermoplastic compositions of the present invention are well suited for the preparation of molded articles that may be metalized over at least a portion of their surface by means of an electroless plating process. Such electroless plated articles are characterized as having improved heat resistance and adhesion of the metal plating.


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