The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 07, 2003

Filed:

Jan. 11, 2000
Applicant:
Inventors:

Yasuyuki Koguchi, Tokyo, JP;

Shigeo Ueki, Tokyo, JP;

Assignee:

DDK Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 3/312 ; B29C 3/342 ; B29C 3/376 ; B29C 3/910 ; B29C 4/514 ;
U.S. Cl.
CPC ...
B29C 3/312 ; B29C 3/342 ; B29C 3/376 ; B29C 3/910 ; B29C 4/514 ;
Abstract

Contacts connected to wires are set in a lower mold and an upper mold is then fitted on the lower mold. The upper and lower molds include contact restraining portions and wire restraining portions, and upper mold holding members and lower mold holding members extending into the cavity at opposite positions enabling these holding members to restrain the wires. The upper and lower molds further include elastic members arranged to urge the upper and lower mold holding members into the cavity of the upper and lower molds for restraining the wire before an insulating plastic material is poured into the cavity. Either of the upper and lower mold is provided with a contact positioning portion adapted to abut against distal ends of the contacts for positioning the contacts relative to the molds. Under closed condition of the molds, an insulating plastic material is poured into the cavity of the molds, while the upper and lower mold holding members are forced away from the wires out of the plastic material by the pressure of the plastic material being poured into the cavity. The plastic material is then cooled or heated so as to be solidified or hardened. After solidification, the upper mold is removed from the lower mold and the harness comprising the contacts and wires held and fixed in the plastic material is then taken out of the lower mold.


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