The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 2003
Filed:
Mar. 21, 2001
Gordon O. Barr, Somerville, MA (US);
EMC Corporation, Hopkinton, MA (US);
Abstract
A nozzle applies fluid (e.g., heated gas) to a solder region of a circuit board component having a set of fluid-delivery edges and a set of fluid-escape edges. The nozzle includes a top member to connect with a fluid source, and a set of fluid-delivery side members coupled to the top member. Each fluid-delivery side member extends from the top member and around a respective fluid-delivery edge of the circuit board component when the circuit board component engages with the nozzle. Each fluid-delivery side member defines (i) at least a portion of a fluid-delivery channel that extends from a vicinity adjacent the top member toward the solder region of the circuit board component when the circuit board component engages with the nozzle, and (ii) a barrier that substantially prevents fluid from escaping from the solder region along the respective fluid-delivery edge for that fluid-delivery side member.