The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6501182 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 31, 2002

Filed:

Jun. 25, 2001
Applicant:
Inventors:

Atsushi Kobayashi, Shiga-ken, JP;

Masaaki Sueyoshi, Shiga-ken, JP;

Masaaki Kanae, Otsu, JP;

Makoto Inai, Omihachiman, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/940 ; H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/940 ; H01L 2/334 ;
Abstract

A semiconductor device includes an element formed on a first surface of a semiconductor substrate, a via-hole passing through the semiconductor substrate from the first surface to a second surface of the semiconductor substrate, and an electrode formed on the inner wall of the via-hole, the electrode passing through the semiconductor substrate from the first surface to the second surface. The electrode in the via-hole is electrically connected to at least one electrode of the element; the semiconductor substrate is mounted on a surface mount board; and the electrode formed on the inner wall of the via-hole is electrically connected to an electrode of the surface mount board by a conductive bonding material, such as a conductive adhesive. A method for fabricating the semiconductor device is also disclosed.


Find Patent Forward Citations

Kobayashi, Atsushi. (2002). Semiconductor device and method for making the same (U.S. Patent No. 6501182). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6501182

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