The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2002
Filed:
Apr. 12, 2001
Applicant:
Inventor:
Yoshie Noguchi, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
A semiconductor device is mounted on a heating stage, and the temperature of the semiconductor device is set to be at least 60° C. and lower than the melting point of a solder. With the use of an ejecting head, molten solder is ejected from a nozzle towards an electrode part. The molten solder ejected from the ejecting head impinges upon the surface of the electrode part. Upon impingement, the molten solder spreads over the surface of the electrode part by wetting, thereby to form a bump electrode on the electrod part. Sufficient joining strength between the bump electrode and the underlying conductive region is ensured.