The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2002
Filed:
Dec. 14, 1999
Applicant:
Inventors:
Tamio Furuya, Hidaka, JP;
Kenichi Chujo, Sayama, JP;
Kazushiro Wakabayashi, Sayama, JP;
Satoru Yamada, Sayama, JP;
Hiroe Hashimoto, Sayama, JP;
Assignee:
Honda Giken Kogyo Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 5/110 ;
U.S. Cl.
CPC ...
B29C 5/110 ;
Abstract
A resin mold has a surface layer formed on the molding surface of a main body from a thermosetting resin and containing fine particles of silicon carbide. The surface layer can be formed simply by thermosetting the resin without calling for any plating, so that the mold can be made in a short time. The high hardness of silicon carbide gives a high wear resistance to the surface layer. The main body is formed from a thermosetting resin and contains metal particles.