The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 31, 2002
Filed:
Feb. 06, 2001
Applicant:
Inventors:
Shingetsu Yamada, Tokyo, JP;
Jun Takagi, Tokyo, JP;
Koichiro Taniguchi, Tokyo, JP;
Kaoru Nomoto, Aichi, JP;
Toshihiro Miyake, Aichi, JP;
Kazuya Sanada, Aichi, JP;
Makoto Totani, Aichi, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01K 3/22 ;
U.S. Cl.
CPC ...
H01K 3/22 ;
Yamada, Shingetsu. (2002). Method of manufacturing three-dimensional printed wiring board (U.S. Patent No. 6499217). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6499217
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile