The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2002
Filed:
Sep. 01, 1999
Yoshitsugu Hori, Shiga-ken, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
An electronic component comprises a substrate having a surface on which an electrode is formed and an SAW circuit element having a surface on which a circuit is formed. The circuit element is held such that the surface of the circuit element and the surface of the substrate are opposed to each other. A bump electrode joins the circuit on the circuit element and the electrode of the substrate together, and a sealing material joins the circuit element and the substrate together in the periphery of the space between the circuit-forming surface of the circuit element and the substrate. The space between the circuit-forming surface of the circuit element and the substrate is hermetically sealed by the circuit element, the substrate, and the sealing material. Advantageously, a low-temperature soldering material such as solder, or an adhesive, is used as the sealing material.