The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2002
Filed:
Sep. 25, 2000
Makoto Watanabe, Tokorozawa, JP;
Citizen Watch Co., Ltd., Nishitokyo, JP;
Abstract
A method of mounting a semiconductor device ( ) comprises the steps of disposing an anisotropic conductive adhesive ( ) on the surface of a circuit board ( ), placing the semiconductor device ( ) on the surface of the circuit board ( ) after aligning bumps ( ) provided on the semiconductor device ( ) with wiring patterns ( ) formed on the surface of the circuit board ( ), respectively, provisionally press-bonding the semiconductor device ( ) onto the circuit board ( ) by heating at a temperature lower than the curing temperature of an adhesive resin ( ) of the anisotropic conductive adhesive ( ) while applying a predetermined pressure thereto by use of a heating and pressurizing tool ( ), and thereafter bonding the semiconductor device ( ), as provisionally press-bonded, onto the circuit board ( ) by heating and curing the adhesive resin ( ) at a temperature causing the same to be cured.