The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2002
Filed:
Jan. 04, 2002
Choon Muah Patricia Lee, Singapore, SG;
Soong Ooi Yong, Singapore, SG;
Pramod Kumar Pandey, Singapore, SG;
Chong Hsu Liu, Singapore, SG;
Infineon Technologies A.G., Munich, DE;
Abstract
A semiconductor chip includes a semiconductor substrate having an electronic circuit theron and a number of bond pads thereon. The bond pads are coupled to the electronic circuit and permit power to be supplied to the electronic circuit and signals to be input to and output from the electronic circuit. The bond pads are arranged on the surface of the substrate such that at least some of the pads are separated from the edge of the substrate by other bond pads. A lead frame is also provided in which two of the contact pins are electrically coupled to each other by a contact strip which extends along at least a portion of an edge of a die pad. The contact strip is located between the die pad and some of the other contact pins.