The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2002

Filed:

Jul. 24, 2001
Applicant:
Inventor:

Horst Grüning, Wettingen, CH;

Assignee:

ABB Industrie AG, Baden, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/302 ;
Abstract

A semiconductor clamped-stack assembly ( ) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components ( ) and a plurality of heat sinks ( ), which are arranged in series along a horizontally extending axial direction (A). According to the invention, power semiconductor components ( ) from different clamped stacks are assigned to one another and are located in a common mounting plane, which is perpendicular to the axial directions (A) of the clamped stacks ( ). Mutually associated power semiconductor components ( ) can be removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction, which lies in the mounting plane. Mutually associated power semiconductor components ( ) are preferably mounted on a common plate ( ). As a result, they can be dismantled when the clamped-stack assembly ( ) is loosened, without further power semiconductor components or heat sinks having to be dismantled. The plate ( ) is hooked into frame rods ( ) belonging to the clamped-stack assembly ( ) or guided in guide rails ( ).


Find Patent Forward Citations

Loading…