The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2002
Filed:
May. 24, 2000
Mitsubishi Engineering-Plastics Corporation, Tokyo, JP;
Abstract
The present invention relates to a molding material for OA machine parts, wherein such material comprises a resin combination of 60 to 98 parts by weight of a polyphenylene ether-based resin, 2 to 40 parts by weight of a thermoplastic elastomer, and 1 to 50 parts by weight of a flame retardant, such that the resin composition has a bending modulus of not less than 1500 MPa as measured at 23° C. according to ASTM D790, a damping ratio of not less than 1.0% at 23° C., and a thermal deformation temperature of not less than 100° C. as measured according to ASTM D648 under 18.6 kg/cm load, and wherein the product of the bending modulus and the damping ratio is not less than 10,000 MPa*%.