The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2002
Filed:
Mar. 07, 2000
Applicant:
Inventor:
Tue Nguyen, Fremont, CA (US);
Assignee:
Simplus Systems Corporation, Fremont, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/14763 ;
Abstract
A method has been provided for improving the adhesion of copper to a nitrided metal diffusion barrier material, such as TiN, in an integrated circuit substrate. The method provided a multilayered diffusion barrier structure, comprising a nitrided metal diffusion barrier layer and an oxy-nitrided metal layer. The formation of an oxy-nitrided metal layer, instead of an oxide layer, permits the optimization of both contact resistance and adhesion property. The oxy-nitrided metal layer is formed either by the partial incorporation of oxygen into the nitrided metal diffusion barrier or by deposition in an oxygen ambient.