The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 17, 2002
Filed:
Aug. 17, 2000
Masami Sakamoto, Aichi-ken, JP;
Yutaka Matsuoka, Aichi-ken, JP;
Mitsutoshi Nakamura, Aichi-ken, JP;
Yoshinobu Seki, Aichi-ken, JP;
Yazaki Corporation, Tokyo, JP;
Abstract
A method of assembling a wire harness circuit includes providing a plurality of module plates, attaching wire connection terminals to predetermined wires of a plurality of wire sub-harnesses, inserting one or more wire connection terminals into selected wire housing grooves on the module plates, laminating the module plates on each other so as to form a laminated body, and inserting at least one connection member into the laminated body through openings in the module plates to electrically connect selected wire connection terminals on respective module plates. A wire harness according to the invention includes a plurality of wire sub-harnesses, each wire sub-harness comprising a plurality of wires, a plurality of wire connection terminals engageable with preselected wires to establish an electrical connection, a plurality of module plates laminated on each other so as to form a laminated body, and at least one connection member insertable into the laminated body through openings in the module plates to electrically connect selected wire connection terminals on respective module plates.