The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2002

Filed:

Sep. 19, 2000
Applicant:
Inventors:

Tetsuyuki Kaneko, Osaka, JP;

Munetsugu Ueyama, Osaka, JP;

Akira Mikumo, Osaka, JP;

Naoki Ayai, Osaka, JP;

Shin-ichi Kobayashi, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 3/924 ;
U.S. Cl.
CPC ...
H01L 3/924 ;
Abstract

Powder including at least a superconducting phase is degassed (step S ). After the powder is filled in a silver pipe (step S ), the silver pipe is degassed at a high temperature (step S ). After a plurality of single-core wires are inserted into another silver pipe to attain a multi-core structure, the silver pipe is degassed at a high temperature (step S ). The silver pipe is sealed under a reduced pressure (step S ). Therefore, even when a multi-core superconducting wire is manufactured, a manufacturing method of a superconducting wire capable of preventing swelling of the wire caused by a residual gaseous component can be obtained.


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