The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2002

Filed:

Aug. 06, 2001
Applicant:
Inventors:

Satoshi Imasu, Hitachinaka, JP;

Ikuo Yoshida, Musashimurayama, JP;

Norio Kishikawa, Ome, JP;

Yoshiyuki Kado, Ome, JP;

Kazuyuki Taguchi, Hamura, JP;

Takahiro Naito, Kodaira, JP;

Toshihiko Sato, Kodaira, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/312 ; H01L 2/350 ;
U.S. Cl.
CPC ...
H01L 2/312 ; H01L 2/350 ;
Abstract

An electronic device comprising: a semiconductor chip having plural electrode pads on one main surface thereof; a wiring board having plural connection parts; and plural salient electrodes disposed respectively between the electrode pads of the semiconductor chip and the connection parts of the wiring board to provide electrical connections between the two, the salient electrodes being arranged in an array not providing balance of the semiconductor chip with respect to one main surface of the wiring board, the plural connection parts of the wiring board being arranged at a deeper position than one main surface of the wiring board in a depth direction from the one main surface.


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