The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2002

Filed:

Dec. 21, 1998
Applicant:
Inventors:

Mariko Kaku, Yokohama, JP;

Kazuhide Yoneya, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/900 ;
U.S. Cl.
CPC ...
H01L 2/900 ;
Abstract

A semiconductor integrated circuit device, which enables impedance adjustment of a particular pad without affecting other pads or signal wirings or without the need for a design change in basic layout, has formed a number of elements and wirings on and in a silicon substrate and pads stacked thereon via an insulation film A particular pad is connected to a signal wiring formed in a bus line region and a capacitor-forming conductor behaving as an impedance adjusting conductor is formed to surround the pad A source line conductor is made in a space between the pad and the capacitor-forming conductor to encircle the capacitor-forming conductor Therefore, the pad capacitance can be increased by using the space around the pad other signal wirings and any others formed in the bus line region are not affected substantially. Since here is used the portion around the pad which is not used normally, the basic layout need not be changed.


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