The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2002

Filed:

Jan. 14, 2002
Applicant:
Inventors:

Takashi Tanaka, Kisarazu, JP;

Mitsuru Kohno, Kisarazu, JP;

Masakazu Ii, Kisarazu, JP;

Keiji Yoshizawa, Kisarazu, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 2/638 ;
U.S. Cl.
CPC ...
B23K 2/638 ;
Abstract

This invention relates to a process for machining resin film for a wiring board or double-sided carrier tape which comprises forming openings in the resin film by applying a continuous-wave carbon dioxide gas laser beam which is scanned in one or two ways to the resin film or a laminate containing a layer of the resin film placed on a worktable ( ) moving in the direction nearly at a right angle to the scanning direction of the laser beam ( ). As a continuous-wave carbon dioxide gas laser beam is used for drilling holes, the operation is highly efficient and accurate and gives rigid-flex wiring boards or double-sided carrier tapes of good quality in high yield.


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