The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2002

Filed:

Jun. 28, 1999
Applicant:
Inventors:

Miguel A. Jimarez, Newark Valley, NY (US);

Ross W. Keesler, Owego, NY (US);

Voya R. Markovich, Endwell, NY (US);

Rajinder S. Rai, Johnson City, NY (US);

Cheryl L. Tytran-Palomaki, Endicott, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 ; H05K 1/11 ; H05K 3/42 ;
U.S. Cl.
CPC ...
H05K 1/09 ; H05K 1/11 ; H05K 3/42 ;
Abstract

A chip carrier structure and method for forming the same having a receptor pad formed therein. The structure comprises a circuitized substrate having a conductive element on the surface, an External Dielectric Layer mounted on the circuitized substrate with an opening positioned above the conductive element to form a microvia. The walls of the microvia are first treated to enhance copper adhesion and then are electroplated to provide a receptor pad. Finally, a solder paste is deposited within the microvia to create a solder deposit or bump.


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