The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2002
Filed:
Nov. 22, 1999
Applicant:
Inventors:
Young-wug Kim, Suwon, KR;
Kyung-tae Lee, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Kyungki-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/14763 ;
Abstract
A method of forming damascene wiring without dishing and erosion employs a dummy layer to slow or delay polishing in selected regions and thereby prevent dishing and erosion of the damascene wiring. The dummy layer is above wide damascene regions and areas containing closely packed damascene regions. Therefore, non-uniform sheet resistance of the damascene metal wiring and electro-migration due to an increase in the local current density of the metal wiring can be prevented.