The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2002
Filed:
Jan. 07, 2002
Tsung-Chieh Chen, Taipei, TW;
PICTA Technology Inc., Taipei, TW;
Abstract
The provision of a semiconductor wafer, which has been formed with a plurality of chips that each can be existent independently; the pre-cure process, in which the buffer layer has not been completely baked or hardened yet, but just for making the buffer layer be in stable condition; the pre-cut process, in which a cut is made at the position of the buffer layer corresponding to the boundary of each IC to make a gap exited between each two adjacent ICs without containing any buffer layer; the post-cut process, in which the buffer layer has completely baked and hardened; the singulation process, in which the both wafer and buffer layer are cut simultaneously to make the plural ICs separated from each other to become IC device that can act independently. Since the invention has processed pre-cut before the complete hardening, so when processing the complete bake, because there is pre-remaining space available for the buffer layer for thermal expansion, it can reduce the stress applied on the wafer to further keep the completeness of the wafer.