The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2002
Filed:
Jan. 13, 1998
Applicant:
Inventor:
Hiroshi Ise, Tokyo, JP;
Assignee:
NEC Corporation, , JP;
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/502 ; B29C 4/514 ; B29C 7/070 ;
U.S. Cl.
CPC ...
B29C 4/502 ; B29C 4/514 ; B29C 7/070 ;
Abstract
A semiconductor chip mounted on a lead frame is sealed in a synthetic resin package through a molding process, and pressure is applied to synthetic resin softened from granular. synthetic resin so as to evacuate the air from the synthetic resin before injecting the synthetic resin into cavities formed in a molding die, thereby preventing the synthetic resin package from void.
Ise, Hiroshi. (2002). Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein (U.S. Patent No. 6491857). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6491857
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile