The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Oct. 10, 2001
Kishan Shenoi, Saratoga, CA (US);
Gary Jacobsen, San Jose, CA (US);
Kamila Kraba, Santa Clara, CA (US);
Chien-Chou Lai, Sunnyvale, CA (US);
Jeremy Sommer, Mountain View, CA (US);
Jining Yang, Sunnyvale, CA (US);
Symmetricom, Inc., San Jose, CA (US);
Abstract
Systems and methods are described for multi-link segmentation and reassembly for bonging multiple virtual circuits in an inverse multiplexing arrangement. A method includes: generating a plurality of multilink segmentation and reassembly sublayer cells at a first location; distributing the plurality of multilink segmentation and reassembly sublayer cells across a plurality of virtual circuits; transmitting the plurality of multilink segmentation and reassembly sublayer cells to a second location via the plurality of virtual circuits; and receiving the plurality of multilink segmentation and reassembly sublayer cells at the second location. An apparatus includes a multilink segmentation and reassembly sublayer transmitter, including: a source buffer; a multilink controller coupled to the source buffer; and a plurality of virtual circuits coupled to the multilink controller.