The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Feb. 16, 2001
Donald Gilbert Killam, Woodinville, WA (US);
Koninklijke Philips Electronics N.V., Eindhoven, NL;
Abstract
An apparatus and method for forming electrical connections in an acoustic transducer wherein a non-conductive bonding material is interposed between a conductive surface on the transducer and a conductive lead. In one embodiment, the conductive surface is comprised of gold, and the conductive lead is comprised of copper that is plated with at least one metallic layer. The metallic layer may be further comprised of an intermediate metal layer that is overlaid by a layer of gold. The intermediate layer may be further comprised of titanium, or an alloy of nickel and chromium. A non-conductive bonding material is deposited on either the lead or the conductive surface, which are joined to form a bonding interface. Electrical conduction is attained through a plurality of contact points that arise from the surface roughness inherent in the materials that project through the bonding interface. Alternatively, the contact points are impressed in the surfaces.