The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Mar. 07, 2000
Young-soo An, Chungcheongnam-do, KR;
Jae-Il Lee, Chungcheongnam-do, KR;
Hyo-geun Chae, Chungcheongnam-do, KR;
Jeong-ho Bang, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Suwon, KR;
Abstract
A socket for testing a BGA package capable of avoiding problems like deformation of external terminals of the BGA package or failing to detect a defective BGA package and a test method using the socket are provided. The socket for testing a BGA package connects solder balls (or solder bumps) as external terminals of the BGA package via a mesh, a pressure conductive rubber (PCR) as a middle connection unit, and a channel connection means of a socket board. A plane board having POGO pins or a printed circuit pattern can be used for the channel connection means.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile