The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
Aug. 27, 2001
Yoshikazu Shimada, Kyoto, JP;
Hiroo Mochida, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
An integrated circuit device as a first IC chip, a second IC chip, and a circuit board having a hole formed therein that is large enough to permit the second IC chip to be accommodated therein. The first and second IC chips are bonded together so as to be electrically connected together, and the first IC chip is mounted on the circuit board with the second IC chip accommodated in the hole formed in the circuit board. Here, one of the IC chips forming a chip-on-chip structure is accommodated in the hole formed in the circuit board, making further thickness reduction possible. Moreover, the obverse surfaces of the IC chips are located closer to the circuit board, making possible wireless mounting of the IC chips, despite forming a chip-on-chip structure, on the circuit board through connection using bumps. This helps reduce trouble due to inductance in a circuit that handles a high-frequency signal.