The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 2002
Filed:
May. 26, 1999
Applicant:
Inventors:
Zenzo Oda, Chino, JP;
Tadashi Komiyama, Kofu, JP;
Toshinori Nakayama, Sakata, JP;
Osamu Omori, Sakata, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
The present invention is a semiconductor device which can improve the adhesive force between a semiconductor chip substrate. This semiconductor device has a semiconductor chip , a die pad (metallic portion) on which the semiconductor chip is fixedly mounted and supported through an adhesive layer , and a sealing resin for sealing the die pad and semiconductor chip . The adhesive layer includes a plurality of conductive adhesive regions and a plurality of insulative adhesive regions together.